联合创新中心

过去几年,高通公司先后在重庆、青岛、南京、南昌和杭州等地联合当地合作伙伴成立联合创新中心,聚焦基于物联网的创新与发展。2019 年 9 月,中国联通与高通公司物联网联合创新中心在南京正式揭牌并投入使用,双方将加深在物联网相关设备和技术方面的合作,共同探索新的物联网产品和物联网应用场景。联合创新中心初期将专注于新零售和 5G 物联网应用,未来有望拓展至智慧能源、智能制造和机器人等广泛领域。

南京软件谷 - Qualcomm中国联合创新中心

时间:2017.09.09签约,2018.07.04揭牌
地点:南京
合作伙伴:

  • 中国(南京)软件谷
  • 南京睿诚华智科技有限公司(Nibiru)

重点领域:XR AI
新闻链接:签约 揭牌

重庆经开区 - Qualcomm中国智能物联网联合创新中心

时间:2017.10.11签约,2018.09.15揭牌
地点:重庆
合作伙伴:

  • 重庆经开区
  • 中科创达

重点领域:物联网 5G
新闻链接:签约 揭牌

青岛芯谷 - Qualcomm中国•歌尔联合创新中心

时间:2017.12.14签约,2019.03.29揭牌
地点:青岛
合作伙伴:

  • 青岛微电子创新中心有限公司
  • 歌尔股份有限公司

重点领域:智能音频 VR/AR 可穿戴等智能硬件 物联网领域
新闻链接:签约 揭牌

红谷滩新区 - Qualcomm•影创联合创新中心

时间:2019.10.20签约
地点:南昌
合作伙伴:

  • 南昌市政府
  • 上海影创信息科技有限公司

重点领域:VR/AR
新闻链接:签约

杭州未来科技城 - Qualcomm中国•中科创达联合创新中心

时间:2020.03.04签约
地点:杭州
合作伙伴:

  • 浙江杭州未来科技城
  • 中科创达软件股份有限公司

重点领域:5G AI 物联网
新闻链接:签约

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