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6月23日,中国内地规模最大、技术最先进的集成电路晶圆代工企业中芯国际集成电路制造有限公司与华为、比利时微电子研究中心(imec)及Qualcomm Incorporated子公司Qualcomm Global Trading Pte. Ltd.在人民大会堂举行了签约仪式,宣布共同投资中芯国际集成电路新技术研发(上海)有限公司,开发下一代CMOS逻辑工艺,打造中国最先进的集成电路研发平台。这项合作受到了各方的关注,国家主席习近平与比利时国王菲利普共同见证了签约仪式。


对于这次合作,Qualcomm Incorporated总裁德里克•阿博利表示:“我们很高兴与中芯国际、华为及IMEC共同投资新技术研发公司,此次合作是中国乃至全球集成电路产业的重要里程碑事件,也意味着Qualcomm一如既往地全力支持中国繁荣的半导体生态系统的持续增长。我们相信新技术研发公司的成立将更好地满足中国本土及全球市场客户对于高性能、低功耗移动终端不断增长的需求,多方合作也将为中国带来更加先进的制程技术和晶圆制造能力,帮助中国建立提升FinFET工艺技术。”

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