Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.



5月19日,Qualcomm宣布将与谷歌展开创新合作,将Android 操作系统功能直接嵌入到汽车中,从而通过更具有开放性、定制化和规模化的方式加速汽车创新。



5月19日在谷歌 I/O大会上展示的概念汽车,就是搭载了面向联网汽车和信息娱乐系统而设计的Qualcomm®骁龙™820汽车处理器。凭借高效的定制CPU、令人惊叹的GPU性能、可支持Cat 12速率快如闪电的X12 LTE调制解调器和强大的视频处理功能,旗舰级的骁龙820汽车处理器将助力汽车制造商打造联网、智能并具有环境感知的可扩展解决方案。


对于这次跨越性的合作,谷歌Android工程总监Patrick Brady表示 :“谷歌与Qualcomm密切合作,希望以安全、无缝的方式将最好的Android功能带到汽车中。”同时Qualcomm Technologies, Inc.产品管理副总裁Nakul Duggal也表示:“我们很高兴与谷歌以及汽车产业生态系统合作,引领新一代的车内体验。”

Opinions expressed in the content posted here are the personal opinions of the original authors, and do not necessarily reflect those of Qualcomm Incorporated or its subsidiaries ("Qualcomm"). The content is provided for informational purposes only and is not meant to be an endorsement or representation by Qualcomm or any other party. This site may also provide links or references to non-Qualcomm sites and resources. Qualcomm makes no representations, warranties, or other commitments whatsoever about any non-Qualcomm sites or third-party resources that may be referenced, accessible from, or linked to this site.

Qualcomm 员工

©2021 Qualcomm Technologies, Inc. and/or its affiliated companies.

沪公网安备 31011502004712 号


References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses. Qualcomm products referenced on this page are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell any of the components or devices referenced herein.