Qualcomm推出Quick Charge 3+,为大众市场带来快速高效的充电技术


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Qualcomm Technologies今日推出Quick Charge系列的最新技术——Qualcomm Quick Charge 3+。作为全球最大的快充生态系统,Quick Charge现已遍布全球市场被超过1000款配件和终端采用。通过提供更快的充电速度和更经济实惠的价格,Quick Charge 3+旨在让全球更多用户享受到Quick Charge技术。

骁龙765和765G将率先支持Quick Charge 3+技术,并且不同层级的全新骁龙平台也有望支持这一技术。搭载骁龙765G的小米10青春版是全球首款同时支持Quick Charge 4+和Quick Charge 3+充电技术的智能手机。

Quick Charge 3+旨在以更实惠的成本提供先进的快速充电技术:
• 更高效率的快速充电:从零电量充电到50%仅需15分钟,充电速度较前代平台提升35%,且机身温度降低9摄氏度*
• Quick Charge 3+将支持业界标准USB Type-A转USB Type-C的连接线和配件,并支持Quick Charge 4以20mV为单位的可扩展调压,对OEM厂商和消费者而言更加经济实惠
• Quick Charge 3+能够提供极其灵活的充电体验,包括向后兼容前代Quick Charge终端,以及支持与Quick Charge 3+配件配合使用
• 其他关键特性:集成充电线的功率检测/识别,以及各种安全特性

Quick Charge 3+支持全新的电源管理集成电路(PMIC):SMB1395/SMB1396
• 可扩展架构让OEM厂商在使用相同软件的情况下实现更高充电功率,并满足PCB设计、充电IC位置等一系列不同的系统需求
• 通过更经济实惠且可调压的Quick Charge 3+充电配件,实现更快的充电体验
• SMB1395/1396让终端不需要依赖过压保护芯片和传感电阻器等外接组件
• SMB1396可支持无线和有线两种输入方式

*基于单IC(SMB1395)和相应的电路板/电池设计。Quick Charge旨在15分钟内充入高达50%的电池电量。实际结果可能因终端设计而不同。Qualcomm骁龙、Qualcomm Quick Charge、Qualcomm SMB1395和Qualcomm SMB1396是Qualcomm Technologies, Inc. 和/或其子公司的产品。

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