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高通推出高通3D Sonic第二代传感器

2021年1月12日

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高通3D Sonic传感器助力旗舰智能手机实现快速、可靠的屏下指纹识别,即使在手指潮湿的情况下也能够准确识别。

高通3D Sonic传感器能够提供更加出色的用户体验,其实现方式是利用不断演进的超声波技术读取用户手指的脊线、沟纹和毛孔等3D特征,从而构建非常精准的指纹图像。因此,即使手指潮湿的情况下,高通3D Sonic超声波指纹传感器也能够穿透玻璃和金属等物体表面进行指纹扫描。

高通3D Sonic传感器采用了厚度不到0.2mm的超薄设计,支持OEM厂商打造具有尖端外形设计的移动终端,比如采用真正无边框的OLED柔性屏。

此前,多款旗舰智能手机括三星Galaxy S10、Note10、S20和Note20系列,已采用了高通技术公司的高通3D Sonic第一代传感器。

在此基础上,高通技术公司今日宣布推出高通3D Sonic第二代传感器。与第一代产品相比,第二代传感器拥有全新的外形尺寸,识别速度提升50%,识别面积增加77%。

高通3D Sonic第一代传感器的尺寸为4x9mm(面积为36mm2),第二代传感器的尺寸提升至8x8mm(面积为64mm2),较前代增加77%。

传感器尺寸的提升,意味着用户能够获得更大的识别面积,这也使得高通3D Sonic传感器采集的生物特征数据提升至原来的1.7倍。更大尺寸的传感器配合更快的处理速度,使得识别速度比前代产品提升50%,让用户能够更快地解锁终端。

高通3D Sonic第二代超传感器预计将于2021年初在移动终端中首次亮相。有关高通3D Sonic超声波传感器的更多信息请参考。

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