多核集成人工智能引擎

Qualcomm 集成人工智能引擎提供创新的终端体验,实现更智能、更直观的交互体验,速度比上一代产品提升 1.8 倍。Hexagon 矢量处理器、Adreno 视觉处理子系统与 Kryo CPU 强强结合,从摄影到语音识别皆能带来令人震撼的高效体验。

Kryo CPU 提供源源不断的动力

Kryo 360 CPU 采用独立的电源和效率集群生产,两个内核用于数据密集型任务,六个内核用于满足日常需求,相比上一代产品,其性能提升了 15%,实现了几乎无缝的超快速多任务处理。

图形增强和 3D 游戏效果

Adreno 615 GPU 可打造类似游戏机的逼真游戏体验,拥有令人惊叹的图形效果和超高清视频捕捉和回放。除此之外,它具有比上一代更低的功耗,拥有能提升速度的 turbo 功能,且能够接入最新的图形 API。

屋内户外 疾速连接

Snapdragon X12 调制解调器经过精心设计,即使是在信号拥挤的区域也支持闪电般快速和可靠的连接,并可以在 LTE 和 Wi-Fi 之间自动切换,从而获得更高质量的音频和视频呼叫,拥有比上一代更丰富的应用体验。

提供动力 应您所需

Qualcomm® QuickCharge™ 4+ 技术可在 15 分钟内为终端从 0 充电 50%。* 这意味着用户能享受更丰富的音乐和视频、更多的游戏和更久的通话,与上一代相比,电池续航时间延长达 30%。

骁龙 670 移动平台规格

Qualcomm® Artificial Intelligence Engine

DSP

  • Qualcomm® Hexagon™ 685 Vector Processor

GPU

  • Qualcomm® Adreno™ 615 GPU

Modem

Modem Name

  • Qualcomm® Snapdragon™ X12 LTE modem

Data Features

LTE Category

  • LTE Category 13 (uplink)
  • LTE Category 12 (downlink)

Downlink Features

  • 3x20 MHz carrier aggregation
  • Up to 256-QAM

Uplink Features

  • Qualcomm® Snapdragon™ Upload+
  • 2x20 MHz carrier aggregation
  • Up to 64-QAM

Peak Download Speed

  • 600 Mbps

Peak Upload Speed

  • 150 Mbps

Cellular

Supported Cellular Technologies

  • Snapdragon All Mode
  • LTE FDD
  • LTE TDD
  • LAA
  • LTE Broadcast
  • WCDMA (DB-DC-HSDPA, DC-HSUPA)
  • TD-SCDMA
  • CDMA 1x
  • EV-DO
  • GSM/EDGE

Telephony Features

Multi SIM

  • Dual SIM Dual VoLTE (DSDV)

Next-generation Calling Services

  • VoLTE with SRVCC to 3G and 2G
  • Voice over Wi-Fi (VoWiFi) with LTE call continuity
  • HD and UltraHD Voice (EVS)

Wi-Fi

Wi-Fi Brand

  • Integrated 11ac Wi-Fi via WCN3680B

Wi-Fi Standards

  • 2x2 802.11ac with Mu-MIMO

Peak Speed

  • 867 Mbps

Bluetooth

Bluetooth Version

  • Bluetooth 5.0

Bluetooth Technology

  • WCN3680B

Peak Speed

  • 2 Mbps

Location

Advanced Location Features

  • Low Power Geofencing and Tracking
  • Sensor-assisted Navigation

Satellite Systems Support

  • QZSS
  • GPS
  • GLONASS
  • Beidou
  • Galileo
  • SBAS

NFC

Near Field Communications

  • Supported

RF

RFFE

  • Qualcomm® Signal Boost adaptive antenna tuning
  • High-power transmit (HPUE)
  • Envelope tracking technology

Camera

Megapixel Support

  • Up to 25 MP single camera
  • Up to 16 MP dual camera

Image Sensor Processor

  • Qualcomm Spectra™ 250 image sensor processor
  • 2x Image Sensor Processor (ISP)
  • 14-bit

Camera Features

  • Ultra HD 4K video capture at 30fps
  • High quality video capture with Motion Compensated Temporal Filtering
  • Accelerated Electronic Image Stabilization
  • Zero Shutter Lag
  • Hybrid Autofocus

Video

Video Capture

  • Up to 4K Ultra HD video capture @ 30FPS
  • Up to 1080p video capture @120 FPS

Video Playback

  • Up to 4K Ultra HD video playback

Codec Support

  • H.264 (AVC)
  • H.265 (HEVC)
  • VP8
  • VP9

Display

Maximum On-Device Display Support

  • 2560x1600
  • FHD+

Maximum External Display Support

  • Up to 4K

Audio

Audio Technology

  • Qualcomm Aqstic™ audio technology
  • Qualcomm® aptX™ codec technology

CPU

CPU Clock Speed

  • Up to 2.0 GHz

CPU Cores

  • 8x Qualcomm® Kryo™ 360 CPU

CPU Bit Architecture

  • 64-bit

Processing

Process Technology

  • 10 nm

DSP

DSP Technology

  • Qualcomm® Hexagon™ 685 DSP
  • Qualcomm® Hexagon™ Vector Processor
  • Qualcomm All-Ways Aware™ technology

GPU

GPU Name

  • Qualcomm® Adreno™ 615 GPU

Charging

Qualcomm® Quick Charge™ Support

  • Qualcomm® Quick Charge™ 4+ technology

Security Support

Security Features

  • Qualcomm® Mobile Security
  • Qualcomm® Processor Security
  • Qualcomm® Content Protection

    Qualcomm Spectra、Qualcomm AI Engine、Qualcomm Hexagon、Qualcomm Adreno、Qualcomm Kryo、Qualcomm Snapdragon、Qualcomm Quick Charge、Qualcomm All-Ways Aware、Qualcomm Processor Security、Qualcomm Mobile Security、Qualcomm Content Protection、Qualcomm Aqstic、Qualcomm aptX 和 Qualcomm Signal Boost 是 Qualcomm Technologies, Inc. 和/或其子公司的产品。

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