骁龙 210 处理器

Qualcomm 骁龙处理器是 Qualcomm Technologies, Inc. 的产品。

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骁龙 210 处理器

Qualcomm® 骁龙™ 210 处理器可为入门级智能手机提供 4G LTE 连接、丰富功能和出色性能,同时还能为您保证续航时间。

骁龙 210 处理器规格

Mobile Computing

Form Factor

  • Smartphones

Modem

Modem Name

  • Qualcomm® Snapdragon™ X5 LTE modem

Data Features

Downlink Features

  • 2x10 MHz carrier aggregation
  • Up to 64-QAM

LTE Category

  • LTE Category 4

Uplink Features

  • 1x20 MHz
  • Up to 16-QAM

Peak Download Speed

  • 150 Mbps

Peak Upload Speed

  • 50 Mbps

Cellular

Supported Cellular Technologies

  • LTE FDD
  • LTE TDD
  • LTE Broadcast
  • WCDMA (DC-HSDPA, DC-HSUPA)
  • TD-SCDMA
  • CDMA 1x
  • EV-DO
  • GSM/EDGE

Telephony Features

Multi SIM

  • LTE Dual SIM

Next-generation Calling Services

  • Wi-Fi calling with LTE call continuity
  • HD Voice over 3G and VoLTE

Wi-Fi

Wi-Fi Standards

  • 802.11n

Bluetooth

Bluetooth Version

  • Bluetooth 4.1†

Bluetooth Technology

  • Bluetooth Low Energy

Location

Qualcomm® IZat™ Support

  • Qualcomm® IZat™ Gen8C

NFC

Near Field Communications

  • Supported*

RF

RFFE

  • Qualcomm® RF360™ front-end solution

USB

USB Version

  • USB 2.0

Camera

Megapixel Support

  • Up to 8 MP camera

Video

Video Capture

  • Up to 720p video capture

Video Playback

  • Up to 1080p video playback

Codec Support

  • H.264 (AVC)
  • H.265 (HEVC)

Display

Maximum On-Device Display Support

  • 720p*
  • 1280x720
  • WXGA

CPU

CPU Clock Speed

  • Up to 1.1 GHz

CPU Cores

  • Quad-core CPU
  • 4x ARM Cortex A7

CPU Bit Architecture

  • 32-bit

DSP

DSP Technology

  • Qualcomm® Hexagon™ DSP

Processing

Process Technology

  • 28 nm LP

GPU

GPU Name

  • Qualcomm® Adreno™ 304 GPU

Charging

Qualcomm® Quick Charge™ Support

  • Qualcomm® Quick Charge™ 2.0 technology

Memory

Memory Speed

  • 533 MHz

Memory Type

  • LPDDR2
  • LPDDR3

Storage

eMMC

  • eMMC 4.5

SD

  • SD 3.0 (UHS-I)

Part

Part Numbers

  • 8909

    † 集成数字内核
    * 仅在部分处理器中可用

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